Overmolding Simulation

3D Shapes is one of just a few Moldflow consultants offering overmolding analysis.

Overmolding is a two shot (or more), sequential molding process that requires MPI/Flow3D. The two-step process analyzes filling of the base component (substrate) and then analyzes the filling of the overmolded material over the substrate. Temperature and conductivity values from the substrate are used in determining the flow characteristics of the overmolded material.

These tools can be very effective in determining the manufacturability of overmolded parts and will also help you improve the part design.